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Crystalline silicon cutting fluid
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                                                      Low foam wetting agent---002


Product information

 Low foam 002 is a nonionic surfactant that does not contain silicone. It can effectively reduce static/dynamic surface tension in aqueous matrices, has outstanding wetting properties, 

and has good low-foaming properties. As a low-foaming wetting agent, JC-002 is widely used in solar silicon cutting fluid and other fields.


Product Properties   

Appearance:  Colorless to yellowish liquid

Color,APHA: <50

PH value(1% aqueous solution): 5.0-7.0

Water, weight %: <0.50

Cloud point(1% aqueous solution,C)): 40-46


Product characteristics

Quickly wets the silicon powder and silicon wafer surface, improves the lubrication stability of the cutting fluid, thereby reducing line marks, TTV and dirty wafers, etc., and increasing the silicon wafer A product rate and output;

Quickly wets the surface of the diamond wire, reduces powder accumulation between diamond abrasives, and maintains the surface roughness of the diamond wire, which is conducive to stable crystalline silicon cutting;

Rapid wetting improves the cooling performance of the cutting fluid to meet the trend of higher and higher linear speeds and the gradual thinning of diamond wire


Storage, transportation

Stored in a cool, dry, and ventilated area, shelf life is two years


Packaging

200kg/1000kg plastic bucket



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