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Acid copper plating

Acid copper plating
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EDTP
                                            EDTP


Chemical nature            
Chemical name: Hexamethylene tramine tra hydroxy propy chloride;
 N,N,N’N’-tetrakis (2-Hydroxypropyl) ethylenedianmine
Molecular formula: C14H32N2O4
Molecular weight: 294.42
CAS No.: 102-60-3
 
Properties          
Physical form: Light yellow to brownish yellow viscous liquid
PH: 8.0-10.0
Content: ≥99%
 
Application      
 EDTP is used as metal complexing agent, used as scaling powder and cleaner in electroless copper PCB plating.

Packing 
 25kg/drum, stored in cool and dry place
Friendly link: EC21