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Copper plating intermediate
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Chemical nature   
Chemical name: Bis-(Sodium Sulfopropyl)-Disulfide
Molecular formula: C6H12Na2 O6S4
Molecular weight: 354.4
CAS No.: 27206-35-5

Appearance: White to yellowish powder
Content (%): ≥90.0 (HPLC)
PH: 3.0 ~ 7.0(38 % water solution)
Solubility(20℃): 38 % water solution is transparent and clear

SPS is used as a brightener in copper electroplating baths at a concentration of 10-50mg/L, it can refine the plating coating crystallization, and improve the current density.

Packing and Storage
25kg/Plastic drum, store in cool and dry place.

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